Sample Processing & Coating

RF/DC Magnetron Sputtering & Thermal Evaporation Coating

Thin-film deposition by sputtering and thermal evaporation

Magnetron sputtering and thermal evaporation deposit thin metal, alloy and oxide films on your substrates under vacuum. They are used to make electrodes, contacts and test coatings of controlled thickness.

4 test optionsDC, RF and co-sputteringFilms from ~5 nm to 1 µmTypical turnaround 5–8 working days
RF/DC Sputtering & Thermal Evaporation Coating processIllustrative
SubstratePlasmaMagnetron targetEvaporation boatVacuum pumpFilm thickness
Atoms released, a film laid downIllustrative
01 / Overview

What is RF/DC Magnetron Sputtering & Thermal Evaporation Coating?

In magnetron sputtering, argon ions from a magnetically confined plasma knock atoms off a target, and these condense on the substrate as a film; DC power suits conductive targets, while RF power also sputters insulators. In thermal evaporation, a metal is heated in a boat until it vaporises and coats the substrate.

Sputtering gives dense, well-adhered films of metals, alloys and oxides, and co-sputtering two targets tunes the composition. Evaporation is gentler and quicker for metals such as Al, Ag or Au, and works well through shadow masks for contacts.

02 / How it works

How it works

  1. 01

    Substrates are loaded

    Clean substrates are mounted on the holder and the chamber is pumped down to high vacuum.

  2. 02

    Plasma is struck

    Argon is let in and RF or DC power ignites a plasma over the magnetron target.

  3. 03

    Film is deposited

    Sputtered atoms, or vapour from a heated boat, travel to the substrate and condense as a film.

  4. 04

    Thickness is controlled

    A crystal thickness monitor and a shutter stop deposition at the agreed thickness.

03 / What it measures

What it measures

Metal films & electrodes

Deposit conductive layers such as Au, Ag, Cu, Al or Ti.

Useful forElectrodes, contacts, conductive coatings

Oxide & insulating films

RF sputtering deposits oxides, nitrides and other insulators.

Useful forDielectric, optical and transparent conducting layers

Alloy & mixed films

Co-sputter two targets at once to tune the film composition.

Useful forDoped films, alloy and composition studies

Evaporated contacts

Thermally evaporate metals such as Al, Ag or Au, often through a shadow mask.

Useful forDevice contacts and patterned electrodes

Controlled thickness

Films from a few nanometres to around a micron, monitored during growth.

Useful forThin-film studies and multilayers
04 / Test options

Choose the RF/DC Magnetron Sputtering & Thermal Evaporation Coating options you need

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RF/DC Magnetron Sputtering & Thermal Evaporation Coating test options
05 / Sample requirements

Sample requirements

Accepted substrates
Glass, silicon, quartz, FTO/ITO glass, metal foils, vacuum-safe polymer films
Size
Typically up to 50 × 50 mm, flat, under ~5 mm thick
Coating material
Common metals and oxides from lab stock; other targets by discussion
Details needed
Material, thickness, number of substrates and any mask pattern
  • Clean, dry, dust-free substrates, ideally degreased
  • State the material, thickness and which side to coat
  • Provide shadow masks if a pattern is needed
  • No wet, oily or outgassing samples
  • No powders or loose particles

Hazardous or air-sensitive samples: mention it in your request, and attach the MSDS if you have one.

06 / Results & turnaround

Results & turnaround

What you receive

  • Coated substrates returned in sealed carriers
  • Deposition log: power, pressure, time and rate
  • Nominal thickness from the crystal monitor
  • Photographs of coated samples
  • Report PDF

Turnaround & pricing

Typically 5–8 working days after samples reach the lab.

Price confirmed in your quotation, depending on user type, options and number of samples.

Sample report · IllustrativeExample film thickness100 nmIllustrative — not measured sample data
07 / Limitations

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